Evgroup.info

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EVG|EVGroup.com

www.evgroup.info/

Most Used Html Elements

  • <a> : 142
  • <li> : 134
  • <ul> : 46
  • <div> : 31
  • <script> : 15
  • <p> : 8
  • <input> : 8
  • <link> : 7
  • <img> : 7
  • <option> : 6
  • <hr> : 4
  • <meta> : 4
  • <span> : 3
  • <h3> : 2

Most Used Html Classes

  • "topitem" : 7
  • "hidden" : 5
  • "boxitem" : 3
  • "border" : 3
  • "heading" : 3
  • "clear" : 2
  • "componentlink" : 2

Where is www.evgroup.info hosted?

Country:
Austria
City:
Wels
Registrar:
Afilias Global Registry Services
Latitude:
48.18
Longitude:
14.02
IP address:
85.31.6.130
IP Binary address:
1010101000111110000011010000010
IP Octal address:
12507603202
IP Hexadecimal address:
551f0682

Context analysis of evgroup.info

Number of letters on this page:
2 268
Number of words on this page:
345
Number of sentences on this page:
7
Average words per sentences on this page:
49
Number of syllables on this page:
751

Domain name architecture

Domain name length:
12
Hyphens:
Domain doesn't contain hyphens!
Domain name with Hindi letters:
ए व ग र ओ उ प . इ ञ फ़ ओ
Domain name with Hebrew letters:
(e) ו ג ר (ο) (u) פּ . (i) נ ף (ο)
Domain name with Cyrillic letters:
e в г р о у п . и н φ о
Domain name with Arabic letters:
(e) (v) غ ر (o) (u) (p) . (i) ن ف (o)
Domain name with Greek letters:
ε (v) γ ρ ο υ π . ι ν φ ο
Domain name with Chinese letters:
伊 维 吉 艾儿 哦 伊吾 屁 . 艾 艾娜 艾弗 哦
Domain without Consonants:
vgrp.nf
Domain without Vowels:
eou.io
Alphabet positions:
e5 v22 g7 r18 o15 u21 p16 . i9 n14 f6 o15
Domain name pattern:
V: Vowel, C: Consonant, N: Number
V C C C V V C . V C C V

<HEAD> DATA INFORMATION

Encoding:
UTF-8
Content-Language:
en
robots:
index,follow

Internal links in evgroup.info

  • #mainNav
  • #content
  • /en/
  • /en/login
  • /en/about/news/2017_08_EVG_Japan_20Years/
  • /en/about/news/2017_07_LaserDebonding/
  • /en/about/news/
  • /en/about/events/
  • http://www.evgroup.com/en/about/news/2017_06_VLSI_WP/
  • /en/about/
  • /en/about/vision
  • /en/about/awards/
  • /en/about/certificates/
  • /en/about/events/technologydays/
  • /en/about/history/
  • /en/about/evgnews/
  • /en/about/purchasing/
  • /en/about/purchasing/demands/
  • /en/about/purchasing/demands/mechanical
  • /en/about/purchasing/demands/electronics
  • /en/about/purchasing/demands/pneumatics
  • /en/about/purchasing/demands/fluidics
  • /en/about/purchasing/demands/vaccuum
  • /en/about/purchasing/demands/optical
  • /en/about/purchasing/conditions
  • /en/about/purchasing/requirements
  • /en/about/purchasing/purchasing_portal
  • /en/about/links
  • /en/about/social_responsibility/
  • /en/about/overview
  • /en/products/
  • /en/products/overview
  • /en/products/lithography/
  • /en/products/lithography/photolithography/
  • /en/products/lithography/photolithography/mask_aligners/
  • /en/products/lithography/photolithography/coaters_developers/
  • /en/products/lithography/photolithography/lithography_track_systems/
  • /en/products/lithography/photolithography/inspection_systems/
  • /en/products/lithography/nanoimprint_systems/
  • /en/products/lithography/nanoimprint_systems/hot_embossing/
  • /en/products/lithography/nanoimprint_systems/uv_nil/
  • /en/products/lithography/nanoimprint_systems/micro_contact_printing/
  • /en/products/bonding/
  • /en/products/bonding/waferbonding/
  • /en/products/bonding/bondalignment/
  • /en/products/bonding/integrated_bonding/
  • /en/products/bonding/soi_bonding/
  • /en/products/bonding/temporary_bonding/
  • /en/products/bonding/inspectionsystems/
  • /en/services/evg_application_lab/
  • /en/solutions/
  • /en/solutions/overview
  • /en/solutions/3d-ic/
  • /en/solutions/3d-ic/introduction
  • /en/solutions/3d-ic/chip_stacking
  • /en/solutions/3d-ic/advanced_c2w_bonding
  • /en/solutions/3d-ic/wafer_bonding
  • /en/solutions/3d-ic/thin_wafer_processing/
  • /en/solutions/3d-ic/thin_wafer_processing/introduction
  • /en/solutions/3d-ic/thin_wafer_processing/thermal_slide_off
  • /en/solutions/3d-ic/thin_wafer_processing/multilayer_adhesive_debonding
  • /en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/
  • /en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/introduction/
  • /en/solutions/3d-ic/thin_wafer_processing/lowtemp_zonebond/open_platform/
  • /en/solutions/3d-ic/thin_wafer_processing/laser_initiated_debonding
  • /en/solutions/cmos_image_sensors/
  • /en/solutions/cmos_image_sensors/introduction/
  • /en/solutions/cmos_image_sensors/backend_lithography/
  • /en/solutions/cmos_image_sensors/glass_bonding/
  • /en/solutions/cmos_image_sensors/oxide_bonding/
  • /en/solutions/cmos_image_sensors/anti_reflective_coatings/
  • /en/solutions/high_brightness_leds/
  • /en/solutions/high_brightness_leds/introduction/
  • /en/solutions/high_brightness_leds/layer_transfer/
  • /en/solutions/high_brightness_leds/imprint_lithography/
  • /en/solutions/high_brightness_leds/optical_lithography/
  • /en/solutions/high_brightness_leds/thin_wafer_handling/
  • /en/solutions/high_brightness_leds/anti_reflective_coatings/
  • /en/solutions/logic_memory/
  • /en/solutions/logic_memory/introduction/
  • /en/solutions/logic_memory/backend_lithography/
  • /en/solutions/logic_memory/wafer_level_bonding/
  • /en/solutions/logic_memory/c2w_bonding/
  • /en/solutions/logic_memory/thin_wafer_handling/
  • /en/solutions/mems_devices/
  • /en/solutions/mems_devices/introduction/
  • /en/solutions/mems_devices/lithography/
  • /en/solutions/mems_devices/first_level_packaging/
  • /en/solutions/microfluidics/
  • /en/solutions/microfluidics/patterning_processes/
  • /en/solutions/microfluidics/device_sealing/
  • /en/solutions/photonic_devices/
  • /en/solutions/photonic_devices/introduction/
  • /en/solutions/photonic_devices/imprint_lithography/
  • /en/solutions/photonic_devices/wafer_bonding_heterogeneous_integration/
  • /en/solutions/photonic_devices/ac2w_bonding/
  • /en/solutions/photonic_devices/anti_reflective_coatings/
  • /en/solutions/photovoltaics/
  • /en/solutions/photovoltaics/introduction/
  • /en/solutions/photovoltaics/imprint_lithography/
  • /en/solutions/photovoltaics/micro_optics/
  • /en/solutions/photovoltaics/wafer_bonding/
  • /en/solutions/photovoltaics/thin_pv_wafers/
  • /en/solutions/photovoltaics/spray_coating/
  • /en/solutions/photovoltaics/optical_lithography/
  • /en/solutions/saw_devices/
  • /en/solutions/saw_devices/introduction/
  • /en/solutions/saw_devices/wafer_level_bonding/
  • /en/solutions/soi_wafers/
  • /en/solutions/soi_wafers/introduction/
  • /en/solutions/soi_wafers/cleaning/
  • /en/solutions/soi_wafers/plasma_activation/
  • /en/solutions/soi_wafers/oxide_bonding/
  • /en/solutions/wafer_level_optics/
  • /en/solutions/wafer_level_optics/introduction/
  • /en/solutions/wafer_level_optics/imprint_lithography/
  • /en/solutions/wafer_level_optics/uv_bonding/
  • /en/solutions/wafer_level_optics/anti_reflective_coatings/
  • /en/markets/
  • /en/markets/overview
  • /en/markets/3dic_advanced_packaging/
  • /en/markets/compound/
  • /en/markets/mems/
  • /en/markets/nanotechnology/
  • /en/markets/soi_engineered_substrates/
  • /en/services/
  • /en/services/overview
  • /en/services/nilphotonics_competence_center/
  • /en/services/support/
  • /en/services/training/
  • /en/careers/
  • /en/contact/
  • /en/feedback
  • /en/sitemap
  • /en/imprint/
  • /en/terms_of_use/

Possible email addresses for evgroup.info

  • info@evgroup.info
  • email@evgroup.info
  • support@evgroup.info
  • contact@evgroup.info
  • admin@evgroup.info
  • postmaster@evgroup.info
  • hostmaster@evgroup.info
  • domain@evgroup.info
  • abuse@evgroup.info

Possible Domain Typos

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